Global Semiconductor Industry updates

1. Normal Computing announced that its world’s first thermodynamic computing chip CN101 has been successfully taped out.

2. Private equity firm Advent plans to acquire Swiss chipmaker U-blox.

3. Samsung Electronics will establish an advanced chip packaging R&D center in Yokohama, Japan, with an investment of 25 billion yen (about USD 170 million).

4. NVIDIA plans to launch a new AI chip B30A, specially supplied to China.

5. From August 18 to August 22, 2025, Kinghelm (www.kinghelm.net) / Slkor (www.slkoric.com) "Star of the Week" is Sun Gaofei, Director of Slkor Business Unit, rewarded with RMB 300 by the company.

6. Dr. Ulrich Bretthauer of X-Fab pointed out that the phase-out of 150mm CMOS technology is not merely a product change, but also a structural risk to the industry.

China Semiconductor Industry updates

1. On August 20, Tianyue Advanced (02631.HK) was listed on the Hong Kong Stock Exchange, with a market capitalization of about HKD 22 billion on the first day.

2. Six major projects, including Shenghe Jingwei’s 3D chip integration project, were officially signed and landed in the Lingang New Area of Shanghai, with a total investment exceeding RMB 40 billion.

3. In the first half of this year, JCET Group achieved operating revenue of RMB 18.61 billion, a year-on-year increase of 20.1%.

4. J Square’s first wafer fab in Hong Kong is expected to start production in 2027, and by 2031 will reach an annual output of 240,000 wafers, meeting the demand of 1.5 million new energy vehicles.

5. Phase I of the Huagong Tech Optoelectronics Innovation Park has officially started production, with an expected output value of over RMB 30 billion.

6. Pengding Holdings’ new project in Huai’an Park, with a total investment of RMB 8 billion, has officially broken ground.