Global Semiconductor Industry updates

1. Semtech has released the first chip of its new LoRa Plus™ series — the LR2021.

2. Japan’s Rapidus has successfully taped out a 2nm GAA test chip and plans to achieve mass production in 2027.

3. According to TrendForce, NAND Flash revenue grew over 20% quarter-on-quarter in Q2 2025, with SK Group’s market share rising to 21%.

4. On August 28, it was reported that Apple’s upcoming A20 chip will debut in the iPhone 18 series next year.

5. Toshiba Japan has launched its third-generation 650V SiC MOSFET in TOLL package.

6. SK hynix has developed the industry’s first high-heat-dissipation mobile DRAM using High-K EMC material and has begun supplying it to customers.

China Semiconductor Industry updates

1. Sources revealed that Shenzhen will soon host a quantum optical computer manufacturing plant, to be built and operated by Beijing Boson Quantum Technology Co., Ltd.

2. Chinese scientists have developed the world’s first adaptive full-band high-speed wireless communication chip based on optoelectronic fusion integration technology, laying a disruptive hardware foundation for the practical adoption of 6G communication.

3. Kinghelm Electronics / Slkormicro Semiconductor (slkormicro.com) headquarters are under intensive renovation. The new office is located on the 18th floor of Tower T2, Lijin City Center!

4. According to data released by the European Automobile Manufacturers’ Association, BYD’s sales in Europe more than tripled in July 2025, with its market share surpassing Tesla.

5. Oriental Crystal Source’s self-developed chiplet system EDA simulation tool PanSys® has successfully passed acceptance by the Beijing Municipal Science and Technology Commission.

6. Naxin Micro announced that its automotive-grade CAN FD transceiver chip NCA1044-Q1 has successfully passed Toyota’s VeLIO certification.