International Tech News:

1. Major WF6 (tungsten hexafluoride) producers such as SK Specialties, Foosung, and Kanto Denka (Japan) have recently informed Korean semiconductor manufacturers including Samsung Electronics, SK Hynix, Dongbu HiTek, and Magnachip that they plan to raise supply prices by 70%–90% starting in 2026.

2. LG Electronics is actively expanding into the advanced semiconductor packaging equipment market, with the company expecting the back-end process equipment sector to reach 43 trillion KRW (approximately USD 30 billion) by 2030.

3. Skyworks Solutions announced plans to acquire Qorvo, with the two companies merging into a large enterprise valued at USD 22 billion, supplying RF chips to Apple and other smartphone manufacturers.

4. SK Hynix has begun equipment installation at its M15X wafer fab in Cheongju, South Korea. The plant’s total long-term investment will exceed 20 trillion KRW (approximately RMB 99.2 billion).

5. On October 28, the 2025 China Electronic Components (New Energy Applications) Supply Chain Innovation Summit was held at the Shenzhen World Exhibition & Convention Center under the theme “Building the Foundation for the Chip Industry, Empowering the Future.”
During a key session — the “K Program Launch Conference” — ten founding organizations including ‌XinXirang Advisory, Zhongmin Semiconductor, and Slkor jointly participated. Zhang Junjun, Business Director of Slkor, attended the event and joined the “GESA Chip Glory China” live broadcast for the electronics industry.

6. NVIDIA and Deutsche Telekom AG plan to build a €1 billion (USD 1.2 billion) data center in Germany.

Domestic Tech News:

1. The Huangshi Damei Technology Project, located in the Daye Lake High-Tech Zone of Hubei Province, has officially commenced operation of its four large-scale intelligent production lines, with a total investment of RMB 4 billion.

2. On October 28, Xi’an ESWIN Materials Technology Co., Ltd. was officially listed on the STAR Market, becoming one of the first registered companies under the new “Growth Tier.”

3. Foxconn (Hon Hai Precision Industry Co., Ltd.) plans to invest TWD 42 billion (USD 1.37 billion) to build an AI computing cluster and supercomputing center.

4. Naxin Microelectronics has launched its NSUC1602 embedded motor driver chip with integrated pre-driver, providing a high-reliability “MCU+” solution for automotive electronic water pumps and oil pumps.

5. The “Hebei Xiong’an Zhongke Proof-of-Concept Fund (Special Fund)” has been officially established, with an initial scale of RMB 20 million.

6. Guangzhou XINBANG Intelligent Equipment Co., Ltd. plans to acquire 100% equity of Wuxi IndyChip Microelectronics Technology Co., Ltd.