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Deutsche Telekom to Partner with NVIDIA to Launch an AI Cloud Platform in the First Quarter of 2026
2025-11-05 68

International Tech News:

1. On November 4, Nokia officially announced its plan to delist from the Euronext Paris Stock Exchange.

2. According to data released by the Semiconductor Industry Association (SIA), global semiconductor sales in the third quarter of 2025 reached $208.4 billion, representing a 15.8% increase compared with the second quarter.

3. OpenAI has signed a $38 billion agreement with Amazon to purchase usage rights for NVIDIA chips.

4. Deutsche Telekom will partner with NVIDIA to launch an AI cloud platform, with the collaboration officially starting in the first quarter of 2026.

5. SK hynix unveiled its memory product roadmap, outlining the development of new storage technologies including HBM, AI-DRAM, and AI-NAND.

6. Software giant SAS Institute announced its withdrawal from the Chinese market, ending 25 years of operations in China.

 

Domestic Tech News:

1. Shaanxi Electronics announced that the 8-inch Advanced Silicon Photonics Integration Technology Innovation Platform, built by the Photoelectronics Pioneer Institute, has officially entered production, releasing a PDK for ultra-low-loss passive SOI integrated silicon nitride products.

2. MediaTek, together with the European Space Agency and other partners, successfully completed the first live 5G-Advanced satellite broadband connection compliant with 3GPP Release 19 using Eutelsat’s OneWeb LEO satellite network.

3. To support rapid business growth and market expansion, Kinghelm & Slkor (www.slkormicro.com) are openly recruiting sales representatives, international sales personnel, and procurement engineers — welcoming motivated and ambitious candidates to join the team.

4. As of September 30, 2025, Guoxin Technology has shipped a cumulative total of over 20 million automotive electronic chips.

5. Dehui Electronics announced a 1.005 billion yuan investment to build a high-performance ceramic circuit board manufacturing base, integrating both R&D and production functions.

6. According to reports, several memory back-end packaging and testing companies, including Nanmao and Huatai, are planning price increases ranging from high single-digit to double-digit percentages, which are expected to be implemented from the end of this year through next year.

 

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