International Tech News:

1. RISC-V has firmly entered the global mainstream processor market, with shipments of RISC-V chips expected to exceed 20 billion units by 2031, and IP revenue projected to reach $2 billion.

2. The market penetration of third-generation semiconductors (SiC/GaN) in data center power supplies is estimated to rise to 17% by 2026, and is expected to surpass 30% by 2030.

3. 2026 will be a pivotal year for humanoid robots moving towards commercialization, with global shipments projected to increase more than sevenfold, surpassing 50,000 units.

4. Nvidia plans to use 12-inch silicon carbide substrates in the advanced packaging process for its next-generation GPU chips, with implementation expected by 2027 at the latest.

5. King Helm (www.kinghelm.com.cn) has fully upgraded its official website. The "King Helm 288 Questions" section has been expanded to "King Helm 388 Questions," offering a comprehensive display of the company’s products and corporate culture!

6. Apple has filed a lawsuit with the Delhi High Court in India to challenge the country’s newly revised antitrust fine laws, aiming to avoid a potential hefty fine of up to $38 billion (approximately 270 billion RMB).

Domestic Tech News:

1. Zhanxin Electronics and Zhejiang University have released a 10kV SiC MOSFET, addressing two key industry challenges: large-chip current-carrying capacity and manufacturing yield. The single-chip size reaches 10mm × 10mm, making it the largest publicly disclosed size to date.

2. Hesai has launched the Fermi C500, a high-performance intelligent main control chip for LiDAR based on the RISC-V architecture, along with the world’s only "photon isolation" safety technology and the revamped 256-line safety LiDAR, ATX.

3. The development and manufacturing center for the SiC chip packaging equipment at Zhongke Guangzhi is about to be completed and put into operation.

4. Vog Electro-Optics is entering the equipment debugging phase for the world’s first and China’s first 8.6th generation AMOLED glass-based photolithography fine processing production line, built with an investment of 628 million yuan.

5. The LED project at BOE Huacan Optoelectronics (Suzhou) Co., Ltd., with a total investment of 2 billion yuan, held its production launch ceremony at the Zhangjiagang Economic Development Zone.

6. Yilian Technology has officially surpassed 100 million global shipments of its self-developed CCS (Cell Connection System) components.