International Tech News:

1. From January to November this year, South Korea's total export value ($640.2 billion) reached a three-year high.  

2. Samsung Electronics and SK Hynix have conducted volume production tests for HBM4, but the price of the hybrid bonding machine is expected to be more than double that of the current TC bonding machines.  

3. In 2024, the top three companies in the global semiconductor packaging and testing industry (ASE Group, Amkor Technology, and JCET Group) will account for about 50% of the market share.  

4. SEMECS and Hanwha Semiconductor plan to launch hybrid bonding equipment, targeting the next-generation HBM market.  

5. On the evening of December 3, multiple engineers from Kinghelm (www.kinghelm.net) and Slkoric (www.slkoric.com) participated in the online self-learning live course "ANSYS Mechanical Applications in Connectors" by Tianyuan Technology, enhancing their core talent competitiveness!  

6. The global integrated circuit packaging and testing industry market size is expected to reach $134.9 billion by 2029, with a compound annual growth rate (CAGR) of 5.9% from 2024 to 2029.  

Domestic Tech News:

1. The domestic robotics market in China is expected to exceed 340 billion RMB in 2025 and could reach 780 billion RMB by 2030, with a CAGR of 18.4%.  

2. In key domestic sectors such as automotive manufacturing, the penetration rate of robots has continued to rise, and it is expected to reach 78% by 2025, saving the industry about 42 billion RMB in costs annually.  

3. From January to October 2025, the added value of China's large-scale electronic information manufacturing industry grew by 10.6% year-on-year, which is 4.5 percentage points higher than the same period in the industrial sector and 1.3 percentage points higher than in the high-tech manufacturing sector.  

4. Xitai Technology held a signing ceremony for its global IC R&D center, display module expansion, and terminal product OEM project in the Tianfu New Area of Meishan, Sichuan. The total investment in the project is 1.6 billion RMB.  

5. The major players in China’s integrated circuit packaging and testing industry include JCET Group, Tongfu Microelectronics, and Huatian Technology.  

6. In the next 3 to 5 years, Nanxin Technology aims to become a key player in the global automotive-grade PMIC market.