Global Semiconductor Industry updates

1. Chipmaking giant Intel has invested over USD 16 billion in research and development (R&D).

2. Samsung Electronics is accelerating the resumption of construction at its Pyeongtaek Plant 5 (P5) in Gyeonggi-do, South Korea, aiming to secure early production capacity for next-generation high-bandwidth memory (HBM).

3. Leading advanced chipmaking equipment supplier ASML will become the largest shareholder of French AI startup Mistral AI, a move designed to strengthen Europe’s technological sovereignty.

4. Tesla’s board of directors has set a new compensation package worth as much as USD 1 trillion for CEO Elon Musk.

5. Mr. Song Shiqiang, General Manager of Kinghelm (www.kinghelm.com.cn) and Slkor, will soon release another insightful article titled “Research on Huaqiangbei ‘Shanzhai Phones’”! As an expert on Huaqiangbei business studies, Mr. Song continues to publish his “Song Shiqiang on Huaqiangbei” series, contributing to a better business environment and successful transformation in Huaqiangbei.

6. Xi’an University of Electronic Science and Technology has made a breakthrough in wide-bandgap semiconductor material integration. The research, titled “Van der Waals β-Ga₂O₃ thin films on polycrystalline diamond substrates”, has been published online in Nature Communications.

China Semiconductor Industry updates

1. A research team led by Zang Faheng at Shanghai Jiao Tong University has developed a highly sensitive porous nanophotonic antenna array biosensing chip.

2. ChangCun Phase III (Wuhan) Integrated Circuit Co., Ltd. has been established with a registered capital of RMB 20.72 billion, with Yangtze Memory Chairman Chen Nanxiang serving as its legal representative.

3. SMIC plans to acquire a 49% equity stake in SMIC Northern Integrated Circuit Manufacturing (Beijing) Co., Ltd.

4. Naxin Micro provides a full portfolio of motor driver IC solutions covering various loads, meeting automotive-grade requirements for high performance and high reliability.

5. Shanghai Southchip Semiconductor Technology Co., Ltd. plans to raise RMB 1.933 billion to fund three major projects, including R&D and industrialization of automotive chips.

6. Tongfu Microelectronics has signed an agreement to establish a semiconductor packaging materials project in Nantong City’s Shibei High-tech Zone, with a planned total investment of about RMB 325 million.