Global Semiconductor Industry updates

1. NVIDIA has launched its new GPU, Rubin CPX, designed specifically for long-context reasoning and video generation applications.

2. Reports indicate that OpenAI will collaborate with Broadcom to develop its first in-house AI chip, with mass production targeted for 2026.

3. According to CINNO Research, the total revenue of major global panel manufacturers reached approximately $56.2 billion in the first half of 2025, with mainland China accounting for over 52%, surpassing half of the market share for the first time.

4. Samsung Electronics DX Division President Roh Tae-moon stated that Samsung will release a tri-fold smartphone by the end of 2025.

5. Apple has announced four new chips, including the next-generation mobile chips A19 Pro and A19 built with third-generation 3nm process technology, as well as the new N1 wireless networking chip and C1X modem.

6. Reports indicate that Dell China plans to lay off employees in Shanghai and Xiamen, mainly affecting the EMC Storage division and Client Solutions Group.

China Semiconductor Industry updates

1. Taixi Micro has released China’s first automotive-grade high-voltage direct-drive ultrasonic sensing chip, the TCAU33.

2. Omdia’s report “China AI Cloud Market, 1H25” shows that China’s AI cloud market reached RMB 22.3 billion in the first half of 2025, with Alibaba Cloud taking the lead with a 35.8% share.

3. SLKOR Micro’s website column “100 Interviews in the Semiconductor Industry” continues to advance, having interviewed over 30 semiconductor founders and industry elites to share insights and entrepreneurial experiences, promoting industry exchange and development.

4. XPeng Motors has announced the official launch of its first European R&D center.

5. XingYao Semiconductor’s 8-inch silicon-based GaN Micro-LED chip pilot line in Wuhan has started operations.

6. Shengmei Shanghai has launched its first KrF process front-end coating and development equipment, the Ultra Lith Kr.