Global Semiconductor Industry updates

1. Qatar’s sovereign wealth fund will invest JPY 8 billion (USD 54 million) in Tekscend Photomasks, a semiconductor photomask manufacturer under Japan’s Toppan.

2. In Q2 2025, India’s PC market (excluding tablets) grew 6% year-on-year, with shipments reaching 3.6 million units.

3. The 27th China Hi-Tech Fair (CHTF) will be held on November 14–16, 2025, at the Shenzhen World Exhibition & Convention Center (Bao’an Hall).

4. The global semiconductor “Foundry 2.0” market recorded a 19% year-on-year revenue increase in Q2 2025.

5. This morning, Kinghelm (www.kinghelm.com.cn) Chief Engineer Qin Xianghong delivered a training session on “Introduction to Kinghelm RF Connectors” to employees, enhancing professional skills and supporting the company’s knowledge engineering initiative.

6. Pomegranate harvest season! Kinghelm and Slkor’s General Manager Mr. Song Shiqiang distributed hundreds of gift boxes of pomegranates to employees, as a token of appreciation for their dedication and hard work.

China Semiconductor Industry updates

1. A new “dual-modal” LiDAR system, jointly developed by Huazhong University of Science and Technology, Tsinghua University, and Beijing Information Science & Technology University, was recently published in the international optics journal Light: Science & Applications.

2. The Xiaomi 17 series will mark the most significant leap in the history of Xiaomi’s flagship digital smartphones, debuting the Snapdragon 8 Gen 5 Ultimate Edition mobile platform globally.

3. GoerTek Optics, a global leader in optical modules, has launched the “SiC-etched full-color diffractive waveguide F30Se,” establishing a technological high ground in AR smart glasses optical display.

4. Telink Semiconductor has introduced the TL721X, a low-power multi-protocol IoT wireless SoC.

5. TCL Technology and partners plan to build an 8.6-generation printed OLED display panel production line, with a total investment of approximately RMB 29.5 billion.

6. JBD has recently released the “Hummingbird II” full-color light engine, which leverages its pioneering hybrid-integrated semiconductor technology to precisely bond red, green, and blue MicroLED chips onto CMOS silicon-based driver circuits.