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SINONITRIDE Unlocks 6" & 8" GaN Substrate Production
2025-09-17 192

Global Semiconductor Industry updates

1. Dr. Rui Wang, Chairman of Intel China, has officially retired. Mr. Zhicong Wang, also a long-serving Intel veteran, will take over the leadership.

2. According to reports, NVIDIA has canceled the launch of its first-generation SOCAMM (System-on-Chip Attached Memory Module) and shifted its development focus to a new version called SOCAMM29.

3. LG Display has confirmed it is expanding the production line at its AP4 plant in Paju, Gyeonggi Province, to meet growing OLED panel orders for Apple’s iPhones.

4. Smartphone manufacturer Nothing Technologies Ltd has recently raised $200 million to develop next-generation AI-native devices.

5. Apple Inc. will invest $2.5 billion to expand its collaboration with Corning, funding the expansion of its glass plant in Kentucky.

6. AMD has announced on GitHub that it will cease maintaining the open-source AMDVLK Vulkan driver, with future Vulkan support on Linux platforms to be fully handled by the Mesa RADV driver.


China Semiconductor Industry updates

1. Loongson Technology has completed the R&D of its first graphics card, the 9A1000, which is expected to enter tape-out in the third quarter of this year.

2. Tencent Cloud President YUEPENG Qiu announced that Tencent Cloud has now fully adapted to mainstream domestic chips and is actively contributing to the open-source community.

3. The slogan collection campaign for Slkor will close tomorrow (September 18). If you have creative ideas or catchy taglines, please send your entries to the official email: slkormicro@slkormicro.com. The company looks forward to your submissions!

4. On September 16, 2025, Hesai Technology officially completed its listing on the Hong Kong Stock Exchange, becoming the world’s first LiDAR company to achieve dual primary listings in both the U.S. and Hong Kong.

5. SINONITRIDE has successfully mastered the manufacturing technology of 6-inch and 8-inch gallium nitride (GaN) single-crystal substrates.

6. The chip reliability laboratory built by Shenzhen Jifeng will officially begin operations on September 19 at the Tongchan New Materials Industrial Park in Nanshan District, Shenzhen.


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