Global Semiconductor Industry updates

1. AMD and Sony Interactive Entertainment announced the launch of a long-term cooperation project called "Project Amethyst", which aims to deeply integrate artificial intelligence and machine learning into future gaming hardware and software.

2. Germany will cut €3 billion from its planned €15 billion support program for the semiconductor industry originally scheduled for 2025–2028.

3. Intel released its next-generation client processor, Intel® Core™ Ultra, codenamed Panther Lake, built on the Intel 18A process technology.

4. Samsung Electronics has been ordered to pay nearly $445.5 million in damages to Collision Communications for infringing patents related to 4G, 5G, and Wi-Fi communication standards.

5. SoftBank acquired ABB’s robotics business for $5.375 billion.

6. Cisco launched the P200 chip for long-distance AI data center connectivity, capable of replacing 92 separate chips with a single chip solution.

China Semiconductor Industry updates

1. Liaoning Hanking Semiconductor Materials Co., Ltd. officially began production at its new Lida Plant high-end production line, achieving a total capacity of 2 billion units.

2. Wingtech Technology announced that the Dutch government has issued an order to freeze adjustments to assets and intellectual property of its subsidiary Nexperia for one year.

3. Slkor (slkormicro.com) launched its new MC34063S buck-boost and inverting application solution last week, inviting customers and distributors to contact the company’s technical team for detailed information.

4. Yuntong Technology signed an agreement to invest 1 billion yuan in a vehicle-grade semiconductor project in the Wenhan Lake International Sci-Tech Innovation Zone, Nanhai.

5. A research team from Fuzhou University successfully fabricated high-performance vertical gallium oxide Schottky power diodes.

6. The engineering team of Xinde Semiconductor successfully completed the FOCT-L full-process technical verification for embedded-bridge fan-out high-performance chip interconnect packaging technology.